IBM推出水冷式3D芯片

由 Bin Chen 于 Jun 8th 2008 @ 8:00AM 发表

IBM的3D芯片通过上下堆栈芯片的方式，提高芯片的处理效能，由于这些排列得密密麻麻的芯片运作起来，会产生十分可观的热能，超过传统冷却法所能处理，因此IBM开发出了新的水冷式冷却法-夹层冷却法(Interlayer cooling)，也就是在芯片间设置像头发一样细的渠道，然后注入冷水帮助散热。

IBM的苏黎世研究实验室(Zurich Research Laboratory)表示，这是第一次将水冷式散热法应用在芯片散热方面，尽管这些散布在各层芯片间的管线只有50微米宽，但在标准4平方公分的芯片中，每平方公分的散热热能却能达到180瓦，也就是说，这个新型冷却法的确管用。

[整理编译自 TG Daily]
[原文连接]

[翻译：Judy]

文章分类: 膝上电脑, 桌面产品

Tags: 3D, IBM

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Satan_L5 @ Jun 8th 2008 8:06AM

啥时候上液氮了。™

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